© 2017-2019 CENOS LLC |  814 Mission St, San Francisco, CA 94103 |  Have a question? Email us 

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Plataforma CENOS - sencillo software de simulación y

modelación 3D para calentamiento por inducción

Software de simulación asequible para todos los ingenieros

"We got an important coil order demonstrating a customer the hardening zone simulation in CENOS."

"CENOS engineers are very supportive helping us in soft-ware use for non-standard simulation cases"

"It is super easy to handle simulation with CENOS"

"CENOS helps us to develop onsite simulation capability"

Read our e-book: 

"The Role Of Simulation In Induction Heating Applications"

Democratizing simulation with open source tools & focused apps

We're making simulation affordable and available for every engineer by connecting the best of open source tools into a simple interface with focused applications:

  • induction heating

  • single-shot hardening

  • scanning heating

  • high frequency heating (surface impedance)

  • DC applications

  • and more

Easy to start, even for non-experienced in simulation

Simulations are easy to handle with our pre-made templates, tutorials & helpful support

Affordable

Simple in use

Individual support

Use CAD files

Easily process your CAD files with CENOS intuitive CAD framework

Supported file types:

Choose a template

Choose from parametrized templates for the most frequently used geometries

Build from scratch

Use a built-in CAD redactor to

create any custom geometry

Planes de precios

Plataforma CENOS - un software de escritorio para Microsoft Windows

LITE

for engineers at smaller companies

€650

Gratis

Para uso educativo, no para uso comercial 

PRO

for frequent professional use

€650

Gratis

Para uso educativo, no para uso comercial 

ENTERPRISE

for teams & multiple users

€650

Gratis

Gratis

Para uso educativo, no para uso comercial 

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SIA "CENOS" ir noslēdzis ar Latvijas Investīciju un attīstības aģentūru 2017.gada 24.aprīlī līgumu Nr.SKV-L-2017/220 par atbalsta saņemšanu pasākuma “Starptautiskās konkurētspējas veicināšana” ietvaros un 2019.gada 4.jūnijā līgumu Nr.IZ-L-2019/26 par atbalstu dalībai izstādēs un konferencēs, kā arī tiešo vizīšu pie potenciālā investora vai sadarbības partnera ārvalstīs nodrošināšanai Eiropas Reģionālās attīstības fonda projektā „Tehnoloģiju pārneses programma” (projekta identifikācijas numurs 1.2.1.2/16/I/001)