Simple induction heating simulation software trusted by industry leaders
Iterate design quickly on a PC to handle engineering job with confidence
"We got an important coil order demonstrating a customer the hardening zone simulation in CENOS."
"CENOS engineers are very supportive helping us in soft-ware use for non-standard simulation cases"
"It is super easy to handle simulation with CENOS"
"CENOS helps us to develop onsite simulation capability"
Heat treatment
Joining processes
General Heating
Read our e-book:
"The Role Of Simulation In Induction Heating Applications"
Democratizing simulation with open source tools & focused apps
We're making simulation affordable and available for every engineer by connecting the best of open source tools into a simple interface with focused applications:
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induction heating
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single-shot hardening
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scanning heating
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high frequency heating (surface impedance)
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DC applications
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and more
Easy to start, even for non-experienced in simulation
Simulations are easy to handle with our pre-made templates, tutorials & helpful support
Affordable
Simple in use
Individual support
Use CAD files
Easily process your CAD files with CENOS intuitive CAD framework
Supported file types:
Choose a template
Choose from parametrized templates for the most frequently used geometries
Build from scratch
Use a built-in CAD redactor to
create any custom geometry
Price plans
CENOS Platform - a desktop software for Microsoft Windows
FREE Academic licence - for students/researchers/teachers
LITE
for engineers at smaller companies
$300
per month
Full functionality
Included 4 days of use per month
Extra days can be purchased additionally
Support via phone & email
Free onboarding training
PRO
for frequent professional use
$800
per month
Unlimited use
Price per seat
Support via phone & email
Free onboarding training
ENTERPRISE
for teams & multiple users
$1200
per month
from
Floating licence
Unlimited use
Support via phone & email
by dedicated simulation engineer
Free onboarding training
Featured on:
SIA "CENOS" ir noslēdzis ar Latvijas Investīciju un attīstības aģentūru 2017.gada 24.aprīlī līgumu Nr.SKV-L-2017/220 par atbalsta saņemšanu pasākuma “Starptautiskās konkurētspējas veicināšana” ietvaros un 2019.gada 4.jūnijā līgumu Nr.IZ-L-2019/26 par atbalstu dalībai izstādēs un konferencēs, kā arī tiešo vizīšu pie potenciālā investora vai sadarbības partnera ārvalstīs nodrošināšanai Eiropas Reģionālās attīstības fonda projektā „Tehnoloģiju pārneses programma” (projekta identifikācijas numurs 1.2.1.2/16/I/001)